Researchers Develop Eco-Friendly Heat-Dissipating Material from Egg Whites

A research team led by Dr. Hyun-Ae Cha at the Korea Institute of Materials Science (KIMS) has successfully developed a novel heat-dissipating composite material that combines environmental sustainability with cost-effective manufacturing. The innovative approach utilizes a protein foaming process derived from egg whites to create a three-dimensional structure of magnesium oxide (MgO) that enhances thermal efficiency. This new material demonstrates a thermal conductivity of up to 2.6 times higher than traditional heat-dissipating composites.

As electronic devices become more sophisticated and compact, they generate increasing amounts of heat, necessitating advanced thermal management technologies. In electric vehicles (EVs), inadequate cooling of batteries can result in performance issues, and in severe cases, may lead to fires or explosions. The development of high-performance thermal interface materials (TIMs) is critical to managing heat effectively in these applications.

Conventional TIMs are created by mixing thermally conductive fillers, typically in particle form, into a polymer matrix. This method often leads to randomly dispersed fillers, which can disrupt thermal pathways and hinder performance. While increasing filler content could enhance thermal conductivity, it poses challenges in processing and raises material costs, thus limiting scalability.

To overcome these limitations, the research team employed a protein foaming technique that allows for a denser and more uniform interconnection of particles. Leveraging the property of egg-white proteins to expand at elevated temperatures, the team successfully constructed a three-dimensional interconnected network. This design enables continuous thermal pathways, ensuring uninterrupted heat transfer.

The resulting composite material boasts a remarkable thermal conductivity of 17.19 W/m·K, making it superior in heat dissipation capabilities compared to commonly utilized aluminum oxide (Al2O3) and nitride-based materials. By integrating this advanced material with epoxy resin, a polymer known for enhancing adhesion, the researchers created a composite suitable for practical applications.

This breakthrough is poised to significantly improve the performance and reliability of devices that generate substantial heat, such as electronic equipment, semiconductor packages, EV batteries, 5G communication devices, and high-performance servers. In South Korea, the market for TIMs is projected to exceed KRW 200 billion annually, yet the country currently relies heavily on imports. The commercialization of this technology could play a vital role in enhancing South Korea’s self-sufficiency in thermal management materials.

Dr. Cha remarked, “Through the protein foaming–based process, we can produce high-thermal-conductivity materials in an eco-friendly and cost-effective way.” She further emphasized that this research exemplifies the potential for developing lightweight, high-performance heat-dissipating materials.

The findings of this research were published on May 28, 2023, in the esteemed journal Advanced Science, which has an impact factor of 15.1, and the study was selected as the cover article for Volume 12, Issue 33. This work was supported by the Nano Materials Technology Development Program of the National Research Foundation of Korea (NRF).

The Korea Institute of Materials Science (KIMS) operates as a non-profit entity funded by the South Korean government, specializing in comprehensive materials technologies. By fostering research and development, KIMS aims to bolster the Korean industry through various initiatives related to materials science.